As a World Class Manufacturer of Printed Circuit Boards, Excel Circuits offers the most competitive pricing for both common build technology and cutting edge prototypes.
We welcome challenges involving experimental construction, manufacturing capabilities, and Optimal Design Criteria.
Our philosophy is based on, "If it can be physically done, we can do it, or we know how and where to get it done."
In some cases, we are able to reach out to specialty manufactures through a cooperative partnership built on our multi-decade spanning industry reputation, to obtain ideas and information regarding special processes beyond our normal operating parameters.
In all cases, we are able to provide the most cost-effective solution, and meet the most demanding deadlines.
|Manufacturing Capabilities:||Common / Standard:||Advanced / Premium / Special:|
|Production Cycle/Lead Time||3 weeks standard for Multilayer;|
2 weeks standard for Single and/or Double-Sided
|3 day, 7 days, and 2 weeks **|
|PCB Construction Technology||Single sided, Double-Sided, Multi-Layer||Up to 24 layer, Blind Via Buried Via, sequencial build|
|Panel Size||18 x 24”||24 x 76”> *|
|Panel Thickness||.031 – .062”||.005“ – .030, .063 – .400” *|
|Substrate Materials||FR4 and/or 185HR glass-filled woven||FR406, FR408, GR, GY, GP, GX, GT, GI glass-filled woven, CEM1, CEM3, Specialty/High Frequency, Roger4003, Polyimide, ceramic filled Teflon, Duroid, N9320-13RF (Neltec), Metal-backed Aluminum, Brass: High Tg Materials include 185HR, IS410; 370HR and NP170 (atavistic) available only upon request*|
|Copper Weight (base, ounce/sq.in.)||0.50, 1, 2, and 3 oz.||4 oz. base; 5.0+ ounce/sq.in. finished *|
|Drilled Hole Size (min.)||.010″ drill (.005~.006″ finished plated)||< .010″ *|
|Mechanical Tolerance||+/-.010” positional||+/-.005” positional|
|Feature Resolution||.006″ traces , .006″ space (“gap”)||<.004“ traces , <.004” space (“gap”)|
|Imagable panel area||17 x 23″||>17.5 x 23.5″*|
|Soldermask (resist)||All boards SMOBC LPI (Green, Red, Blue and Clear)||LPI (any color), Wet (Green. Black, other); Peelable / strippable solder mask; Plugged/capped via;|
|Soldermask to land clearance||.004″ (LPI) ; .008″(screenable wet epoxy)||<.004″(LPI) ; <.008″(screenable wet epoxy) *|
|Soldermask dam (LPI)||.008″||.004″ (LPI) *|
|Etched feature : artwork deviation||+/-.0007″ (1/2 oz. copper) ; .002″ (1.0 oz. copper)||Please call for specifications on copper weights over 1.0 ounce/sq.in. *|
|Plated-thru hole aspect ratio||5:1||12:1 *|
|Copper Plating Thickness||.001″ nominal||> .001″ *|
|Final Metalic Finishes||Tin-Lead HASL (Hot Air Solder Level),|
Conductive Carbon ink
“Hard” Gold (Electrolytic)
ENIG (Electroless Nickel/Immersion Gold)
Soft Bondable Gold